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Silicon ingots slicing and wafer manufacturing |
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 From the start of solar business development by JSC "KVAZAR" in 1997, we slice silicon ingots into wafers for solar power engineering, using up-to-date technology of wire-slicing.
We use wire-slicing from HCT. We render our customers the service of slicing ingots into wafers, as well square shaping. A combination of wafer slicing and square shaping offer catching opportunities. If you have square, pseudo-square or round ingots, do not hesitate to contact us. КSquare or pseudo-square ingots of any size up to 156 mm x 156 mm are sliced into thin wafers according to customer’s requirements. Nominal thickness of a wafer can reach 130 microns and more.  High quality monitoring system guarantees the conformity of quality of the wafers to customer’s requirements to obtain high productivity. Our production process guarantees the traceability of each wafer to the ingot/block. Certain wafer characteristics are discussed with each customer at his request and production process. Thereby we guarantee high quality and the least industrial costs. ISO 9001:2000 Certificate of January 20, 2006
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